Guangdong, China
Business Type:
Manufacturer/Factory & Trading Company
Business Range:
Manufacturing & Processing Machinery
Average Lead Time:
Peak season lead time: one month
Off season lead time: one month
OEM/ODM Availability:
Yes
OEM/ODM Service
Sample Available
MEI Awards
Distributorship Cooperation

Machine Tool, Laser Engraving Machine, CNC Machine manufacturer / supplier in China, offering UV Laser Marking Engraving Machine, Fiber Laser Cutting Machine 3015 Ipg Laser Source Beckhoff Control System, Supplier Metal Fiber Cutting Laser Machine and so on.

Gold Member Since 2016
Audited Supplier

UV Laser Marking Engraving Machine

Get Latest Price
Min. Order / Reference FOB Price
1 Set US $40,000-150,000/ Set
Port: Nansha, China
Production Capacity: 100 Sets Per Month
Payment Terms: L/C, T/T, D/P, Western Union, Paypal
Laser Visibility: Invisible
Applicable Material: Metal and Nonmetal
Cooling System: Air Cooling
Technical Class: Pulse Laser
Laser Wavelength: Deep Ultraviolet
Laser Classification: Solid Laser

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Basic Info

Type: UV Laser
Marking Method: Scanning Marking
Power Requirement: 220V/50Hz/5A
Machine Power: 500W
Trademark: Hymson
Transport Package: Exporting Standard Package
Specification: 100kg
Origin: Guangzhou, China
HS Code: 8456100090

Product Description

UV Laser Marking Machine:
UV Laser Marking Engraving Machine

Product effect:

UV Laser Marking Engraving Machine
Features:
(1)UV laser with stable air-cooling.
(2)Choose a variety of modes for first pulse suppression, to achieve the best inhibitory effect.
(3)UV laser can offer a variety of different average laser power and pulse width, fit for different processing requirement.
(4)UV laser temperature control PID with high precision.

Industry Application:
(1)It is appropriate to be used in surface marking and micro holes of glass, high polymer material and related objects.
(2)Widely used in food, medicine,cosmetics, wires and other polymer materials bottles (box) surface marking,micropores (pore diameter d <10μm>.Flexible PCB plate, LCD, TFT marking, scribing incisionetc.
(3)Wipe off metal and non-metal coating.
(4)Microporous and blind holeprocessing of silicon Wafer.

Parameters:
Machine modelH-05355
Laser wavelength355nm
Output power>5W@20KHz
Pulse width13-80ns
Power stability<±2%rms
Beam qualityM2<1.3
Repeat frequency1KHz-200 KHz
Divergence angle of light<2mrad
Bin.line width0.01mm
Polarization100:1vertical
Cooling wayair-cooling
Power requirement220V/50Hz/5A
Machine power500W

UV Laser Marking Engraving Machine

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