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Guangzhou Hymson Laser Technology Co., Ltd.

Fiber Laser Marking Machine, Cutting Machine, Laser Engraving Machine manufacturer / supplier in China, offering 30W Fiber Laser Marking for Metal Nonmetal Ring Ceramics, Supplier Metal Fiber Cutting Laser Machine, Hymson Kitchenware Industry Metal Processing and Cutting Equipment and so on.

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Supplier Homepage Product Laser marking series 30W Fiber Laser Marking for Metal Nonmetal Ring Ceramics

30W Fiber Laser Marking for Metal Nonmetal Ring Ceramics

FOB Price: Get Latest Price
Min. Order: 1 Piece
Port: Nansha, China
Transport Package: Standard Plywood Case
Payment Terms: L/C, T/T

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Basic Info
  • Model NO.: HMX-GR30WA-4600
  • Applicable Material: Metal Nonmetal
  • Technical Class: Pulse Laser
  • Laser Classification: Solid Laser
  • Type of Laser: 532nm 30W
  • Min. Focus Spot: 20um
  • Laser Processing Speed: 100-3000mm/S (Adjustable)
  • Feeding Methods: Manual / Automatic (Optional)
  • Power Supply of The Whole Machine: 5kw / AC220V / 50Hz
  • Origin: Guangzhou, China
  • Laser Visibility: Visible
  • Cooling System: Air Cooling
  • Laser Wavelength: Fiber Laser
  • Type: Optical Fiber Laser Marking Machine
  • Single-Pass Max. Working Scope: 50X50mm
  • Max. Working Scope of Laser Processing: 460X460mm (Free Joining Together)
  • Maximum Moving Speed of Xy Platform: 600/S 1g Accelerated Speed
  • Cooling Method: Air Cooling
  • Extenal Dimension: 1700mmx1350mmx1850mm
Product Description
30W fiber laser marking for metal nonmetal ring ceramics

30W Fiber Laser Marking for Metal Nonmetal Ring Ceramics

Diversified Application

It is applicable for micro-drilling and precise cutting process of all materials, including sapphire glass, tempered glass, ceramic materials, semiconductor materials, high polymer materials, ultra-thin metals and diamond film three-axis motion platform.


1. High cost-performance ratio.
2. User friendly operation interface.
3. Easy to learn and convenient.
4. Laser processing with much less cost than mechanicalcutting.

MicroCut operating system

1. Concise and beautiful.
2. Safety protection.

3. Permission classification operating system.
4. Operating mode much simpler than point-and-shoot camera.

High-end intelligent processing equipment
Low-cost solution
Clean production
Processing without mechanical stress
Laser cutting of diamond film
Laser scribing ceramics
Laser application for biomedical technology
Laser scribing of ITO
Laser drilling and laser cutting of chip and crisp hard material


Machine modelHMX- UV12SA- 4600HMX- UV15SA- 4HHMX- UV10HA- 4600HMX- GR30WA- 4600
Type of laser355nm 12W355nm 15W355nm 10W532nm 30W
Single-pass max. working scope50x50mm
Min. focus spot20um20um20um30um
Max. working scope of laser processing460x460mm ( free joining together )
Stitching precision processing route≤±3um
Laser processing speed100-3000mm/s  (adjustable)
MMaximum moving speed of XY platform600/s 1G accelerated speed
Repeat accuracy of XY platform≤±1um
Location precision of XY platform≤±3um
CCD location precision≤±3um
Feeding methodsManualManualManual/automatic (optional)Manual
Cooling methodAir cooling
Power supply of the whole machine5KW / AC220V / 50Hz
Extenal dimension1700mmX1350mmX1850mm

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30W Fiber Laser Marking for Metal Nonmetal Ring Ceramics

30W Fiber Laser Marking for Metal Nonmetal Ring Ceramics


30W Fiber Laser Marking for Metal Nonmetal Ring Ceramics
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